The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn-1Ag-0.5Cu solder alloy
نویسندگان
چکیده
منابع مشابه
Structural and Mechanical Characterization of Austempered Cu - Sn Ductile Iron Alloys
The effect of heat treatment and alloying elements of copper and tin on the microstructure and mechanical properties of austempered ductile cast iron alloys is investigated. The austenitizing temperature of 890°C, the isothermal transformation (austempering) temperatures of 285, 335 and 375°C, and austempering times of 15, 30, 75 and 150 minutes are studied. The alloying elements of copper and ...
متن کاملEffect of the Bi content on the mechanical properties of a Sn-Zn-Al-Bi solder alloy
Because of environmental and health concerns, some alternative solder alloys, named lead-free ones, are being developed. Among them, the Sn-Zn-Al system has been studied and reveals promising properties. Selection of the solder alloys, for the electronic industry applications, is conditioned by their mechanical properties due to the stress produced in service. The studied alloys were produced b...
متن کاملInfluence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy
In this study, an addition of Ag micro-particles (8–10 lm) with a content in the range between 0 and 1.5 wt.% to Sn–9Zn eutectic solder, were examined in order to understand the effect of Ag additions as the particulate reinforcement on the microstructural and mechanical properties as well as the thermal behavior of the newly developed composite solders. Here, an approach to prepare a micro-com...
متن کاملSoldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition
Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present ...
متن کاملMechanical Properties and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy
The influence of alloy composition of lowmelting Sn-Bi-Cu lead-free solder alloys on mechanical properties and solder joint reliabilities were investigated. The mechanically optimum alloy composition is Sn-40Bi-0.1Cu (mass%). The addition of 40mass%Bi improves the ductility and restrains the fillet-lifting, which are problems of lead-free solders with Bi. The addition of copper improves both th...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
عنوان ژورنال:
- Microelectronics Reliability
دوره 55 شماره
صفحات -
تاریخ انتشار 2015